 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6240 Issued Date : 1992.11.25 Revised Date : 2002.04.03 Page No. : 1/4 H2N3906 PNP EPITAXIAL PLANAR TRANSISTOR Description The H2N3906 is designed for general purpose switching and amplifier applications. Absolute Maximum Ratings TO-92 * Maximum Temperatures Storage Temperature ........................................................................................... -55 ~ +150 C Junction Temperature.................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ........................................................................................ -40 V VCEO Collector to Emitter Voltage..................................................................................... -40 V VEBO Emitter to Base Voltage............................................................................................. -5 V IC Collector Current ...................................................................................................... -200 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICEX *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 fT Cob Min. -40 -40 -5 -650 60 80 100 60 30 250 Typ. Max. -50 -250 -400 -850 -950 300 4 Unit V V V nA mV mV mV mV Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCE=-30V, VBE=-3V IB=-1mA, IC=-10mA IB=-5mA, IC=-50mA IB=-1mA, IC=-10mA IB=-5mA, IC=-50mA VCE=-1V, IC=-100uA VCE=-1V, IC=-1mA VCE=-1V, IC=-10mA VCE=-1V, IC=-50mA VCE=-1V, IC=-100mA VCE=-20V, IC=-10mA,, f=100MHz VCB=-5V, IE=0, f=1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF H2N3906 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HE6240 Issued Date : 1992.11.25 Revised Date : 2002.04.03 Page No. : 2/4 Saturation Voltage & Collector Current 125 C o Saturation Voltage (mV) 125 C o o 25 C o 75 C 100 o hFE 100 75 C o 25 C VCE(sat) @ IC=10IB hFE @ VCE=1V 10 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 Cutoff Frequency & Collector Current 1000 Saturation Voltage (mV) Cutoff Frequency (MHz).. . fT @ VCE=20V 75 C 1000 25 C o o 100 125 C VBE(sat) @ IC=10IB o 100 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 100 10 Safe Operation Area Collector Current (mA) Capacitance (Pf) 1 PT=1ms PT=100ms 0.1 PT=1s 10 Cob 1 0.1 1 10 100 0.01 1 10 100 Reverse Biased Voltage (V) Forward Biased Voltage (V) H2N3906 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6240 Issued Date : 1992.11.25 Revised Date : 2002.04.03 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD (mW) 500 400 300 200 100 0 0 50 100 o 150 200 Ambient Temperature-Ta ( C) H2N3906 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6240 Issued Date : 1992.11.25 Revised Date : 2002.04.03 Page No. : 4/4 2 Marking: H 2N 3906 Control Code 3 C Style: Pin 1.Emitter 2.Base 3.Collector D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 H2N3906 HSMC Product Specification |
Price & Availability of H2N3906
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |